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Power Power plants · Utilities · Transmission · Substations · On-site generation Open section →

Electricity is the first input of AI. Gigawatt-scale campuses are signing nuclear offtakes, building gas turbines behind the meter, and waiting years in interconnection queues.

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Data Centers Hyperscale campuses · Colocation · GPU clouds Open section →

The buildings: shells, substations, chillers and halls engineered around rack densities that have jumped from ~10 kW to 120+ kW per rack.

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Systems Servers · Racks · Networking · Cooling Open section →

Accelerators ship inside engineered systems — 8-GPU baseboards, rack-scale NVLink domains, InfiniBand and Ethernet fabrics, direct-to-chip liquid loops.

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Semiconductors GPUs · AI accelerators · CPUs · Memory · Foundries · Packaging Open section →

The chips themselves: leading-edge logic from a handful of foundries, stacked HBM memory, and advanced packaging that has become its own bottleneck.

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Software CUDA · ROCm · PyTorch · Inference engines · Cluster management Open section →

The layer that turns racks into computers: kernels, compilers, frameworks, schedulers and serving engines — and the moats they create.

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Models Foundation models · Reasoning models · Multimodal models Open section →

What the machines are for: frontier and open-weights models, from GPT and Claude and Gemini to DeepSeek, Llama and Qwen.

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Applications Assistants · Agents · Coding tools · Robotics · Enterprise AI Open section →

Where AI meets users: chat assistants, coding agents, creative tools, scientific systems and robots.

One chip, whole stack: the B200 worked example

The relationship engine in action — every stored connection of one record, each end clickable. Every record page works this way.

NVIDIA B200
competes AMD Instinct MI355X competes Google TPU v7 (Ironwood) deployed at Stargate Abilene deployed at xAI Colossus designed by NVIDIA interconnect NVLink & NVSwitch interconnect Spectrum-X Ethernet made by TSMC memory from Micron Technology memory from SK hynix offered by Amazon Web Services offered by CoreWeave offered by Google (Alphabet) offered by Microsoft offered by Nebius offered by Oracle packaged by TSMC packaged with CoWoS process TSMC N4P / 4NP succeeded by NVIDIA B300 (Blackwell Ultra) uses memory HBM3E

Relationships are bidirectional: what one record lists as "manufactured by", the other lists as "manufactures".