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Home › Chips › NVIDIA B200

NVIDIA B200

Chip GPU Shipping

Blackwell: two reticle-limit dies fused into one GPU — the 2025 workhorse.

You're looking at a chip record: what this processor is, its key specs, who designs, manufactures and supplies its parts, and where it gets used.

Blackwell hit the reticle limit and kept going: the B200 joins two 104-billion-transistor dies with a 10 TB/s die-to-die link so they behave as one 208-billion-transistor GPU. It introduced FP4 precision for inference, moved to CoWoS-L packaging, and in its rack-scale GB200 form made liquid cooling mandatory at the frontier. Every major cloud deployed it through 2025.

Specifications & key facts

Each figure is labeled by basis: vendor spec, vendor claim, reported, estimate, or official. "Not publicly disclosed" means exactly that — we never invent values.

Overview

Designer NVIDIA
Architecture Blackwell
Announced March 2024 (GTC); volume through 2025
Status Shipping

Manufacturing

Foundry / process TSMC 4NPVendor spec
Transistors 208 billion (2 × 104B dies)Vendor spec
Die-to-die link NV-HBI — 10 TB/sVendor spec
Packaging CoWoS-L, 8 HBM3E stacksVendor spec

Memory

Memory 192 GB HBM3E (8 × 24 GB stacks)Vendor spec
Memory bandwidth 8 TB/sVendor spec

Compute

BF16 tensor (dense) 2.25 PFLOPSVendor spec NVIDIA datasheets often headline throughput with structured sparsity; figures here are dense unless noted.
FP8 tensor (dense) 4.5 PFLOPSVendor spec
FP4 tensor (dense) 9 PFLOPSVendor spec FP4 with second-generation Transformer Engine is new in Blackwell

Power

TDP up to ~1,000 (HGX, configurable); 1,200 in GB200 configurations WVendor spec

Physical

Form factors SXM (HGX B200), GB200 superchip
Interconnect NVLink 5 — 1.8 TB/sVendor spec

Price

Price ~$30,000–40,000 per GPU indicated by NVIDIA leadership in 2024Reported

How this connects to the rest of the stack

This record's links at a glance — click a group to jump to it. +9 more groups below.

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Sources

NVIDIA Blackwell page ↗ · DGX B200 datasheet ↗

Record reviewed as of 2026-01-15 — see Methodology.