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首页 › 芯片 › NVIDIA H100

NVIDIA H100

芯片 GPU 发货中

The GPU of the ChatGPT era — the unit of account for the 2023–25 AI build-out.

您正在查看一条芯片记录:该处理器是什么、其关键规格、谁设计它、谁制造它、谁供应其零部件,以及它被用在哪里。

Hopper's H100 became the defining commodity of the AI boom: clusters were sized in H100s, startups raised funding denominated in them, and export policy was written around them. Its Transformer Engine pairs fourth-generation tensor cores with FP8 precision, roughly tripling A100 training throughput per chip.

xAI's Colossus assembled roughly 100,000 of them in 122 days; Meta, Microsoft, OpenAI, Google and every major cloud deployed them in the hundreds of thousands. Blackwell succeeded it in 2025, but H100/H200 fleets still carry a large share of world AI compute.

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Overview

Designer NVIDIA
Architecture Hopper (GH100)
Announced March 2022 (GTC); shipping volume from early 2023
Status Shipping — succeeded by Blackwell at the frontier

Manufacturing

Foundry / process TSMC 4N (custom 5 nm-class)Vendor spec
Transistors 80 billionVendor spec
Die size 814 mm²Vendor spec
Packaging CoWoS-S with 5 or 6 HBM stacksVendor spec

内存

Memory 80 GB HBM3 (SXM); 94 GB HBM3 (NVL); 80 GB HBM2e (PCIe)Vendor spec
Memory bandwidth 3.35 (SXM) / 3.9 (NVL) TB/sVendor spec

算力

TF32 tensor (dense) 495 TFLOPSVendor spec NVIDIA datasheets often headline throughput with structured sparsity; figures here are dense unless noted.
BF16/FP16 tensor (dense) 990 TFLOPSVendor spec
FP8 tensor (dense) 1,979 TFLOPSVendor spec FP8 via the Transformer Engine was Hopper's signature feature
INT8 tensor (dense) 1,979 TOPSVendor spec
FP64 tensor 67 TFLOPSVendor spec

AI Performance

MLPerf Set the reference results for training and inference benchmarks across 2023–24 submissionsMLPerf

电力

TDP up to 700 (SXM) / 350 (PCIe) WVendor spec

Physical

Form factors SXM5, PCIe, NVL (paired PCIe)
Interconnect NVLink 4 — 900 GB/s; PCIe 5.0Vendor spec

价格

Launch price Not publicly disclosed
Market price ~$25,000–40,000 per GPU at the 2023–24 peakReported
Cloud rental Roughly $2–7 per GPU-hour across major and specialist clouds during 2025 — falling steadilyReported varies with commitment and provider

它如何与整个技术栈相连

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设计方

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封装

封装服务商

内存技术

内存供应商

互联与网络

支持方

部署于

基础来源

后继产品

前代产品

来源

NVIDIA H100 page ↗ · Hopper architecture whitepaper ↗

记录审阅截至 2026-01-15 — 查看 方法论.