NVIDIA H200
Hopper with 141 GB of HBM3E — the memory upgrade inference was waiting for.
You're looking at a chip record: what this processor is, its key specs, who designs, manufactures and supplies its parts, and where it gets used.
The H200 pairs the H100 die with 141 GB of HBM3E at 4.8 TB/s — 76% more capacity and 43% more bandwidth. Because LLM inference is usually memory-bound, that alone delivered up to ~2x serving throughput on large models without any new compute. It was the first product to ship HBM3E and bridged the gap to Blackwell.
Specifications & key facts
Each figure is labeled by basis: vendor spec, vendor claim, reported, estimate, or official. "Not publicly disclosed" means exactly that — we never invent values.
Overview
Manufacturing
Memory
Compute
Power
Physical
How this connects to the rest of the stack
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Manufactured by
Process node
Packaging
Memory technology
Memory supplied by
Found inside
Available from
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Sources
Record reviewed as of 2026-01-15 — see Methodology.