Chiplets ☆

Chiplets split a processor into smaller dies stitched together in the package: small dies yield far better, mix process nodes (compute on N3, I/O on N6), and scale past the reticle limit. AMD's MI300 (12+ dies) and NVIDIA's dual-die Blackwell mark the industry's convergence; standards like UCIe aim to make chiplets from different vendors interoperable.