{"data":{"slug":"chiplets-note","etype":"concept","name":"Chiplets","cat":"Hardware & Compute","subtitle":"Many small dies, one big chip — yield economics beat monoliths.","summary":"Chiplets split a processor into smaller dies stitched together in the package: small dies yield far better, mix process nodes (compute on N3, I/O on N6), and scale past the reticle limit. AMD's MI300 (12+ dies) and NVIDIA's dual-die Blackwell mark the industry's convergence; standards like UCIe aim to make chiplets from different vendors interoperable.","attrs":null,"kf":null,"aliases":["chiplet","UCIe"],"ticker":null,"exchange":null,"hq":null,"founded":null,"website":null,"status":null,"region":null,"asof":"2026-01-15","sources":[{"url":"https://www.uciexpress.org/","label":"UCIe consortium"}]},"meta":{"found":true,"count":1,"served_from":"site cache (no live upstream calls)","as_of":"2026-10-14T09:50:07+00:00","disclaimer":"Research and information only — not investment advice. Structured records carry basis labels (vendor spec / reported / estimate); market quotes are delayed/indicative.","attribution":"Records compiled from vendor documentation, official filings and reputable public reporting; market quotes via financial data providers. See /data-sources."}}