★
Menu
Home How It's Built Watchlist The Stack
Hardware ChipsCompare Chips Servers & SystemsNetworking MemoryFoundries & Packaging Cooling
Facilities Data CentersPower ProjectsCloud & GPU Compute
Intelligence AI ModelsSoftware AI ProductsBenchmarks Research PapersDatasets Concepts
Ecosystem CompaniesStocks PeopleTimeline TrendsFuture of AI
Learn News Ask the Data AI Agents
About About us Methodology Data & API Disclaimer
Options
DATA & API

Free read-only JSON access to the site's cached data.

Dark mode

Guided View
New to chips, data centers and model jargon? We explain key terms as you browse, in plain English. Same data, with the help built in.

Expert View
You already know the stack. Just the data: clean, fast and compact, with no extra explanations. This is the default view.

Interface language
‹ Back
Home › Chips › AMD Instinct MI300X

AMD Instinct MI300X

Chip GPU Shipping

AMD's serious challenge to Hopper — more memory than H100, adopted by Microsoft and Meta.

You're looking at a chip record: what this processor is, its key specs, who designs, manufactures and supplies its parts, and where it gets used.

The MI300X stacked 8 CDNA3 compute chiplets on 4 base dies — 153 billion transistors, more than any GPU before it — with 192 GB of HBM3 when the H100 had 80. That memory advantage won real deployments: Azure ran GPT-4-class serving on it, Meta served Llama on it, and it proved the ROCm software stack at scale. The knock: software maturity, not silicon, remained AMD's gap.

Specifications & key facts

Each figure is labeled by basis: vendor spec, vendor claim, reported, estimate, or official. "Not publicly disclosed" means exactly that — we never invent values.

Overview

Designer AMD
Architecture CDNA 3, chiplet (8 XCD + 4 IOD)
Announced Launched December 2023
Status Shipping

Manufacturing

Foundry / process TSMC N5 compute dies on N6 base diesVendor spec
Transistors 153 billionVendor spec
Packaging CoWoS + SoIC 3D hybrid bondingVendor spec

Memory

Memory 192 GB HBM3 (8 stacks)Vendor spec
Memory bandwidth 5.3 TB/sVendor spec

Compute

BF16/FP16 (dense) 1,307 TFLOPSVendor spec
FP8 (dense) 2,615 TFLOPSVendor spec
FP64 matrix 163.4 TFLOPSVendor spec

Power

TDP 750 WVendor spec

Physical

Form factor OAM; 8-GPU UBB platformVendor spec
Interconnect Infinity Fabric — 896 GB/s aggregate per GPUVendor spec

Price

Price Reported meaningfully below H100 street pricing; AMD does not publish list pricesReported

How this connects to the rest of the stack

This record's links at a glance — click a group to jump to it. +6 more groups below.

Designed by

AMD

Manufactured by

Memory technology

Memory supplied by

Runs

Supported by

Available from

Succeeded by

Successor to

Competes with

Sources

AMD MI300X announcement ↗

Record reviewed as of 2026-01-15 — see Methodology.