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HBM4
Technology
Memory
2026's generation: a 2,048-bit interface and logic-die base from the foundries.
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HBM4 doubles the interface width to 2,048 bits, targets ~2 TB/s per stack, and for the first time uses foundry-made logic base dies (SK hynix partnering with TSMC) — blurring the memory/logic boundary. It feeds Rubin and MI400 in 2026; vendors shipped first samples in 2025 and describe demand as sold out well ahead.
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Record reviewed as of 2026-01-15 — see Methodology.