{"data":{"slug":"hbm4","etype":"tech","name":"HBM4","cat":"Memory","subtitle":"2026's generation: a 2,048-bit interface and logic-die base from the foundries.","summary":"HBM4 doubles the interface width to 2,048 bits, targets ~2 TB/s per stack, and for the first time uses foundry-made logic base dies (SK hynix partnering with TSMC) — blurring the memory/logic boundary. It feeds Rubin and MI400 in 2026; vendors shipped first samples in 2025 and describe demand as sold out well ahead.","attrs":null,"kf":null,"aliases":["HBM 4"],"ticker":null,"exchange":null,"hq":null,"founded":null,"website":null,"status":null,"region":null,"asof":"2026-01-15","sources":[{"url":"https://www.jedec.org/news","label":"JEDEC HBM4 standard news"}]},"meta":{"found":true,"count":1,"served_from":"site cache (no live upstream calls)","as_of":"2026-10-14T06:50:47+00:00","disclaimer":"Research and information only — not investment advice. Structured records carry basis labels (vendor spec / reported / estimate); market quotes are delayed/indicative.","attribution":"Records compiled from vendor documentation, official filings and reputable public reporting; market quotes via financial data providers. See /data-sources."}}