Home › Technologies › HBM3E
HBM3E
Technology
Memory
The 2024–26 workhorse: up to 36 GB per stack in 12-high form.
You're looking at a technology record: a building block of AI hardware — what it does, who makes it, and which chips and systems use it.
HBM3E raised pin speeds past 9 Gb/s (~1.2 TB/s per stack) and stacked 12 dies for 36 GB per stack — the memory in H200, Blackwell, MI325X/MI355X, Ironwood and peers. All three suppliers ship it; it made 192–288 GB per GPU standard.
How this connects to the rest of the stack
This record's links at a glance — click a group to jump to it.
Used as memory in
Succeeded by
Successor to
Related
Sources
Record reviewed as of 2026-01-15 — see Methodology.