{"data":{"slug":"hbm3e","etype":"tech","name":"HBM3E","cat":"Memory","subtitle":"The 2024–26 workhorse: up to 36 GB per stack in 12-high form.","summary":"HBM3E raised pin speeds past 9 Gb/s (~1.2 TB/s per stack) and stacked 12 dies for 36 GB per stack — the memory in H200, Blackwell, MI325X/MI355X, Ironwood and peers. All three suppliers ship it; it made 192–288 GB per GPU standard.","attrs":null,"kf":null,"aliases":["HBM 3E","HBM3e"],"ticker":null,"exchange":null,"hq":null,"founded":null,"website":null,"status":null,"region":null,"asof":"2026-01-15","sources":[{"url":"https://product.skhynix.com/hbm","label":"SK hynix HBM"}]},"meta":{"found":true,"count":1,"served_from":"site cache (no live upstream calls)","as_of":"2026-10-14T03:38:57+00:00","disclaimer":"Research and information only — not investment advice. Structured records carry basis labels (vendor spec / reported / estimate); market quotes are delayed/indicative.","attribution":"Records compiled from vendor documentation, official filings and reputable public reporting; market quotes via financial data providers. See /data-sources."}}