DISCO Corporation
Company
Semiconductor Equipment
6146.T · TSE
The company that cuts and grinds nearly every advanced chip.
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Price (delayed)59,620 JPY
Day1.78%
Week-10.72%
YTD14.44%
Market cap6.47T JPY
As of03:27 UTC
Quotes are delayed/indicative; research only, never investment advice.
DISCO holds a dominant share of the dicing saws and wafer grinders that thin wafers for stacking and singulate HBM and logic dies — a quiet chokepoint: advanced packaging volumes cannot grow without its tools.
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Record reviewed as of 2026-01-15 — see Methodology.