{"data":{"slug":"disco","etype":"company","name":"DISCO Corporation","cat":"Semiconductor Equipment","subtitle":"The company that cuts and grinds nearly every advanced chip.","summary":"DISCO holds a dominant share of the dicing saws and wafer grinders that thin wafers for stacking and singulate HBM and logic dies — a quiet chokepoint: advanced packaging volumes cannot grow without its tools.","attrs":null,"kf":{"hq":"Tokyo, JP"},"aliases":["Disco"],"ticker":"6146.T","exchange":"TSE","hq":"Tokyo, Japan","founded":null,"website":"https://www.disco.co.jp","status":null,"region":null,"asof":"2026-01-15","sources":[{"url":"https://www.disco.co.jp/eg/","label":"DISCO"}]},"meta":{"found":true,"count":1,"served_from":"site cache (no live upstream calls)","as_of":"2026-10-14T03:56:51+00:00","disclaimer":"Research and information only — not investment advice. Structured records carry basis labels (vendor spec / reported / estimate); market quotes are delayed/indicative.","attribution":"Records compiled from vendor documentation, official filings and reputable public reporting; market quotes via financial data providers. See /data-sources."}}