AMD Instinct MI355X
芯片
GPU
发货中
CDNA4 on 3 nm: 288 GB HBM3E, FP4/FP6 support, and Blackwell-class ambitions.
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Launched June 2025, the MI355X moves AMD to TSMC N3P and 185 billion transistors, adds FP4 and FP6 datatypes, and carries 288 GB of HBM3E at 8 TB/s. AMD's published figures — 10.1 PFLOPS FP8, 20.1 PFLOPS FP4 — put it in direct contention with Blackwell, and OpenAI, Meta, Microsoft and Oracle all appeared as named customers or partners during 2025. The liquid-cooled MI355X runs to 1,400 W.
规格与关键参数
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Overview
Designer
AMD
Architecture
CDNA 4, chiplet
Announced
Launched June 2025
Status
Shipping
Manufacturing
Foundry / process
TSMC N3P compute diesVendor spec
Transistors
185 billionVendor spec
内存
Memory
288 GB HBM3EVendor spec
Memory bandwidth
8 TB/sVendor spec
算力
FP8 (dense)
10.1 PFLOPSVendor spec
FP6/FP4 (dense)
20.1 PFLOPSVendor spec
BF16 (dense)
5.0 PFLOPSVendor spec
电力
TDP
1,400 (liquid) / MI350X 1,000 (air) WVendor spec
Physical
Form factor
OAM; 8-GPU UBB platform
它如何与整个技术栈相连
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设计方
由……制造
工艺节点
封装
内存技术
支持方
前代产品
来源
AMD Advancing AI 2025 announcement ↗
记录审阅截至 2026-01-15 — 查看 方法论.