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TSMC N3 (3 nm)
Technology
Process Node
The current leading edge in volume: MI355X, Trainium3, Rubin-class parts.
You're looking at a technology record: a building block of AI hardware — what it does, who makes it, and which chips and systems use it.
The N3 family (N3B/N3E/N3P) is TSMC's densest FinFET generation, running at full utilization on smartphone and AI demand. AMD's CDNA4 ships on N3P; NVIDIA's Rubin generation is reported on 3 nm-class variants.
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Record reviewed as of 2026-01-15 — see Methodology.