{"data":{"slug":"tsmc-n3","etype":"tech","name":"TSMC N3 (3 nm)","cat":"Process Node","subtitle":"The current leading edge in volume: MI355X, Trainium3, Rubin-class parts.","summary":"The N3 family (N3B/N3E/N3P) is TSMC's densest FinFET generation, running at full utilization on smartphone and AI demand. AMD's CDNA4 ships on N3P; NVIDIA's Rubin generation is reported on 3 nm-class variants.","attrs":null,"kf":null,"aliases":["3nm","N3E","N3P"],"ticker":null,"exchange":null,"hq":null,"founded":null,"website":null,"status":null,"region":null,"asof":"2026-01-15","sources":[{"url":"https://www.tsmc.com/english/dedicatedFoundry/technology/logic","label":"TSMC technology"}]},"meta":{"found":true,"count":1,"served_from":"site cache (no live upstream calls)","as_of":"2026-10-14T08:56:19+00:00","disclaimer":"Research and information only — not investment advice. Structured records carry basis labels (vendor spec / reported / estimate); market quotes are delayed/indicative.","attribution":"Records compiled from vendor documentation, official filings and reputable public reporting; market quotes via financial data providers. See /data-sources."}}