Home › Technologies › SoIC (3D Stacking)
SoIC (3D Stacking)
Technology
Packaging
TSMC's die-on-die hybrid bonding — true 3D chips.
You're looking at a technology record: a building block of AI hardware — what it does, who makes it, and which chips and systems use it.
System-on-Integrated-Chips bonds dies face-to-face with copper pads at micron pitch — no bumps, near-monolithic density. AMD's MI300 builds compute dies atop base dies with it; future HBM base dies and Rubin-era designs expand it. Besi and Applied Materials supply the bonding tools.
How this connects to the rest of the stack
This record's links at a glance — click a group to jump to it.
Used for packaging of
Maintained by
Sources
Record reviewed as of 2026-01-15 — see Methodology.