{"data":{"slug":"soic","etype":"tech","name":"SoIC (3D Stacking)","cat":"Packaging","subtitle":"TSMC's die-on-die hybrid bonding — true 3D chips.","summary":"System-on-Integrated-Chips bonds dies face-to-face with copper pads at micron pitch — no bumps, near-monolithic density. AMD's MI300 builds compute dies atop base dies with it; future HBM base dies and Rubin-era designs expand it. Besi and Applied Materials supply the bonding tools.","attrs":null,"kf":null,"aliases":["hybrid bonding","3D stacking"],"ticker":null,"exchange":null,"hq":null,"founded":null,"website":null,"status":null,"region":null,"asof":"2026-01-15","sources":[{"url":"https://3dfabric.tsmc.com/","label":"TSMC 3DFabric"}]},"meta":{"found":true,"count":1,"served_from":"site cache (no live upstream calls)","as_of":"2026-10-14T09:46:01+00:00","disclaimer":"Research and information only — not investment advice. Structured records carry basis labels (vendor spec / reported / estimate); market quotes are delayed/indicative.","attribution":"Records compiled from vendor documentation, official filings and reputable public reporting; market quotes via financial data providers. See /data-sources."}}