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Intel 18A
Technology
Process Node
America's leading-edge hope: RibbonFET + backside power at Intel's fabs.
You're looking at a technology record: a building block of AI hardware — what it does, who makes it, and which chips and systems use it.
18A combines gate-all-around RibbonFET transistors with PowerVia backside power delivery — a feature Intel shipped before TSMC. Panther Lake CPUs lead it into production from late 2025 in Arizona; winning external AI customers for it is the existential test of Intel Foundry.
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Record reviewed as of 2026-01-15 — see Methodology.