现场笔记
热量是每一瓦AI算力都要缴纳的税,自从120 kW机架出现以来,缴税就意味着布管道。本节最适合作为一个前后对比的故事来读:2022年风扇遍布,2025年冷板遍地,液浸冷却蓄势待发。
从这三个开始
DT
Direct-to-Chip Liquid Cooling
自Blackwell以来,前沿部署的必选项。这项技术正在重塑每一个机房。
VE
Vertiv
股市将其视为散热赛道晴雨表的那家公司。
IC
Immersion Cooling
迄今尚无人被迫迈出的一步——把整台服务器浸入液体。
Cooling technologies
5
DT
Direct-to-Chip Liquid Cooling
Cold plates on every die — mandatory at Blackwell rack densities.
AC
Air Cooling
Fans, heatsinks and hot aisles — sufficient until ~40 kW per rack.
CD
Coolant Distribution Units (CDU)
The pumps and plate exchangers marshaling megawatts of liquid loops.
IC
Immersion Cooling
Whole servers submerged in dielectric fluid — density without limit, adoption with friction.
RD
Rear-Door Heat Exchangers
Liquid-cooled doors that upgrade air racks without touching servers.
Cooling & thermal companies
7
VE
Vertiv
The pure-play data-center infrastructure leader: cooling, UPS, busway.
AS
Asetek
The liquid-cooling patent pioneer, from gaming PCs to data centers.
BO
Boyd
Thermal engineering at scale: cold plates, loops and heat exchangers.
CS
CoolIT Systems
Cold plates and CDUs from the direct-liquid-cooling pioneer.
LI
LiquidStack
Immersion-cooling specialist now spanning tanks and CDUs.
MU
Munters
Air-handling and evaporative cooling for hyperscale halls.
SU
Submer
European immersion-cooling maker for dense AI and edge compute.