BE Semiconductor (Besi)
Company
Semiconductor Equipment
BESI.AS · Euronext
The hybrid-bonding specialist for the 3D-stacking era.
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Price (delayed)171.55 EUR
Day-0.55%
Week-1.85%
YTD15.69%
Market cap13.58B EUR
As of11:27 UTC
Quotes are delayed/indicative; research only, never investment advice.
Besi leads in hybrid bonding — the copper-to-copper die-stacking technique behind TSMC's SoIC and the future of HBM base dies — a small company holding an outsized position in packaging's next step.
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Record reviewed as of 2026-01-15 — see Methodology.