{"data":{"slug":"besi","etype":"company","name":"BE Semiconductor (Besi)","cat":"Semiconductor Equipment","subtitle":"The hybrid-bonding specialist for the 3D-stacking era.","summary":"Besi leads in hybrid bonding — the copper-to-copper die-stacking technique behind TSMC's SoIC and the future of HBM base dies — a small company holding an outsized position in packaging's next step.","attrs":null,"kf":{"hq":"Duiven, NL"},"aliases":["BE Semiconductor Industries"],"ticker":"BESI.AS","exchange":"Euronext","hq":"Duiven, Netherlands","founded":null,"website":"https://www.besi.com","status":null,"region":null,"asof":"2026-01-15","sources":[{"url":"https://www.besi.com/","label":"Besi"}]},"meta":{"found":true,"count":1,"served_from":"site cache (no live upstream calls)","as_of":"2026-10-14T12:05:00+00:00","disclaimer":"Research and information only — not investment advice. Structured records carry basis labels (vendor spec / reported / estimate); market quotes are delayed/indicative.","attribution":"Records compiled from vendor documentation, official filings and reputable public reporting; market quotes via financial data providers. See /data-sources."}}