NVIDIA Rubin
芯片
GPU
筹建中
The 2026 architecture: HBM4, the Vera CPU, and NVL144 racks.
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Rubin is NVIDIA's next platform, named for astronomer Vera Rubin and announced on the annual-cadence roadmap at GTC 2025. Disclosed targets: two reticle-size dies, 288 GB of HBM4, roughly 50 dense PFLOPS of FP4 per package, and Vera Rubin NVL144 racks in the second half of 2026, with a four-die Rubin Ultra and ~600 kW NVL576 racks targeted for 2027. All figures are announced targets, not shipping specs.
规格与关键参数
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Overview
Designer
NVIDIA
Architecture
Rubin
Announced
March 2025 (GTC roadmap); systems targeted 2H 2026
Status
Ramping — production began June 2026; first systems reaching hyperscalers through Q3 2026 (reported)
Manufacturing
Process
TSMC 3 nm-classReported
内存
Memory
288 GB HBM4 per package (announced)Vendor claim
算力
FP4 (announced)
~50 PFLOPSVendor claim
Physical
Platform
Vera Rubin NVL144 (2026); Rubin Ultra NVL576 (2027, ~600 kW/rack)Vendor claim
它如何与整个技术栈相连
本记录的关联链接一览——点击分组可直接跳转。
设计方
由……制造
内存技术
互联与网络
来源
NVIDIA GTC 2025 keynote roadmap ↗
记录审阅截至 2026-08-31 — 查看 方法论.