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Home › Chips › NVIDIA Rubin

NVIDIA Rubin

Chip GPU Ramping

The 2026 architecture: HBM4, the Vera CPU, and NVL144 racks.

You're looking at a chip record: what this processor is, its key specs, who designs, manufactures and supplies its parts, and where it gets used.

Rubin is NVIDIA's next platform, named for astronomer Vera Rubin and announced on the annual-cadence roadmap at GTC 2025. Disclosed targets: two reticle-size dies, 288 GB of HBM4, roughly 50 dense PFLOPS of FP4 per package, and Vera Rubin NVL144 racks in the second half of 2026, with a four-die Rubin Ultra and ~600 kW NVL576 racks targeted for 2027. All figures are announced targets, not shipping specs.

Specifications & key facts

Each figure is labeled by basis: vendor spec, vendor claim, reported, estimate, or official. "Not publicly disclosed" means exactly that — we never invent values.

Overview

Designer NVIDIA
Architecture Rubin
Announced March 2025 (GTC roadmap); systems targeted 2H 2026
Status Ramping — production began June 2026; first systems reaching hyperscalers through Q3 2026 (reported)

Manufacturing

Process TSMC 3 nm-classReported

Memory

Memory 288 GB HBM4 per package (announced)Vendor claim

Compute

FP4 (announced) ~50 PFLOPSVendor claim

Physical

Platform Vera Rubin NVL144 (2026); Rubin Ultra NVL576 (2027, ~600 kW/rack)Vendor claim

How this connects to the rest of the stack

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Sources

NVIDIA GTC 2025 keynote roadmap ↗

Record reviewed as of 2026-08-31 — see Methodology.