Huawei Ascend 910C
芯片
AI加速器
发货中
China's frontier chip under sanctions: two 910B dies, SMIC 7 nm, no EUV.
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The Ascend 910C pairs two 910B dies to reach roughly H100-class training compute — reported around 800 BF16 TFLOPS — fabricated at SMIC on 7 nm-class DUV multi-patterning because EUV tools are export-banned. Yields and HBM supply are its reported constraints. Huawei's CloudMatrix 384 system lashes 384 of them together with optical links, trading power for scale. Most figures are analyst estimates; Huawei publishes little.
规格与关键参数
每个数据均标注来源依据：厂商规格、厂商声明、公开报道、估算或官方数据。"未公开披露"即字面含义——我们从不捏造数值。
Overview
Designer
Huawei (HiSilicon)
Status
Shipping in China; export-restricted supply chain
Manufacturing
Foundry / process
SMIC 7 nm-class (DUV multi-patterning)Reported
算力
BF16
~800 TFLOPS (dual-die)Estimate
内存
Memory
128 GB HBM2E (8 stacks, dual-die)Estimate
Physical
System
CloudMatrix 384: 384 chips, optical interconnect, ~560 kWReported
它如何与整个技术栈相连
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设计方
由……制造
竞品
来源
SemiAnalysis on CloudMatrix (April 2025) ↗
记录审阅截至 2026-01-15 — 查看 方法论.