AMD Instinct MI250X
芯片
GPU
上一代
The chiplet GPU that powered Frontier, the first exascale supercomputer.
您正在查看一条芯片记录：该处理器是什么、其关键规格、谁设计它、谁制造它、谁供应其零部件，以及它被用在哪里。
The MI250X put two CDNA2 dies in one OAM package with 128 GB of HBM2e — AMD's chiplet strategy applied to accelerators before NVIDIA adopted multi-die designs. It powered Oak Ridge's Frontier, the machine that broke the exascale barrier in 2022, and established AMD as the alternative at the top of HPC.
规格与关键参数
每个数据均标注来源依据：厂商规格、厂商声明、公开报道、估算或官方数据。"未公开披露"即字面含义——我们从不捏造数值。
Overview
Designer
AMD
Architecture
CDNA 2, dual-die
Announced
November 2021
Manufacturing
Foundry / process
TSMC N6Vendor spec
Transistors
58.2 billion (2 dies)Vendor spec
内存
Memory
128 GB HBM2eVendor spec
Memory bandwidth
3.28 TB/sVendor spec
算力
BF16/FP16 matrix
383 TFLOPSVendor spec
FP64 matrix
95.7 TFLOPSVendor spec
double-precision leadership made it an HPC flagship
电力
TDP
500–560 WVendor spec
Physical
Form factor
OAM (OCP Accelerator Module)
它如何与整个技术栈相连
本记录的关联链接一览——点击分组可直接跳转。
设计方
由……制造
内存技术
内部包含
后继产品
竞品
来源
记录审阅截至 2026-01-15 — 查看 方法论.