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Home › Chips › AMD Instinct MI250X

AMD Instinct MI250X

Chip GPU Prior generation

The chiplet GPU that powered Frontier, the first exascale supercomputer.

You're looking at a chip record: what this processor is, its key specs, who designs, manufactures and supplies its parts, and where it gets used.

The MI250X put two CDNA2 dies in one OAM package with 128 GB of HBM2e — AMD's chiplet strategy applied to accelerators before NVIDIA adopted multi-die designs. It powered Oak Ridge's Frontier, the machine that broke the exascale barrier in 2022, and established AMD as the alternative at the top of HPC.

Specifications & key facts

Each figure is labeled by basis: vendor spec, vendor claim, reported, estimate, or official. "Not publicly disclosed" means exactly that — we never invent values.

Overview

Designer AMD
Architecture CDNA 2, dual-die
Announced November 2021

Manufacturing

Foundry / process TSMC N6Vendor spec
Transistors 58.2 billion (2 dies)Vendor spec

Memory

Memory 128 GB HBM2eVendor spec
Memory bandwidth 3.28 TB/sVendor spec

Compute

BF16/FP16 matrix 383 TFLOPSVendor spec
FP64 matrix 95.7 TFLOPSVendor spec double-precision leadership made it an HPC flagship

Power

TDP 500–560 WVendor spec

Physical

Form factor OAM (OCP Accelerator Module)

How this connects to the rest of the stack

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Designed by

AMD

Manufactured by

Memory technology

Found inside

Succeeded by

Competes with

Sources

AMD Instinct accelerators ↗

Record reviewed as of 2026-01-15 — see Methodology.