Bandingkan
Lembar spesifikasi berdampingan untuk chip, sistem, dan model. Setiap angka menyertakan label dasarnya — klaim vendor yang berdampingan dengan estimasi diberi label secara tepat.
| AMD Instinct MI355X CDNA4 on 3 nm: 288 GB HBM3E, FP4/FP6 support, and Blackwell-class ambitions. | NVIDIA B200 Blackwell: two reticle-limit dies fused into one GPU — the 2025 workhorse. | |
|---|---|---|
| Overview — Designer | AMD | NVIDIA |
| Overview — Architecture | CDNA 4, chiplet | Blackwell |
| Overview — Announced | Launched June 2025 | March 2024 (GTC); volume through 2025 |
| Overview — Status | Shipping | Shipping |
| Manufacturing — Foundry / process | TSMC N3P compute diesVendor spec | TSMC 4NPVendor spec |
| Manufacturing — Transistors | 185 billionVendor spec | 208 billion (2 × 104B dies)Vendor spec |
| Memory — Memory | 288 GB HBM3EVendor spec | 192 GB HBM3E (8 × 24 GB stacks)Vendor spec |
| Memory — Memory bandwidth | 8 TB/sVendor spec | 8 TB/sVendor spec |
| Compute — FP8 (dense) | 10.1 PFLOPSVendor spec | — |
| Compute — FP6/FP4 (dense) | 20.1 PFLOPSVendor spec | — |
| Compute — BF16 (dense) | 5.0 PFLOPSVendor spec | — |
| Power — TDP | 1,400 (liquid) / MI350X 1,000 (air) WVendor spec | up to ~1,000 (HGX, configurable); 1,200 in GB200 configurations WVendor spec |
| Physical — Form factor | OAM; 8-GPU UBB platform | — |
| Manufacturing — Die-to-die link | — | NV-HBI — 10 TB/sVendor spec |
| Manufacturing — Packaging | — | CoWoS-L, 8 HBM3E stacksVendor spec |
| Compute — BF16 tensor (dense) | — | 2.25 PFLOPSVendor spec |
| Compute — FP8 tensor (dense) | — | 4.5 PFLOPSVendor spec |
| Compute — FP4 tensor (dense) | — | 9 PFLOPSVendor spec |
| Physical — Form factors | — | SXM (HGX B200), GB200 superchip |
| Physical — Interconnect | — | NVLink 5 — 1.8 TB/sVendor spec |
| Price — Price | — | ~$30,000–40,000 per GPU indicated by NVIDIA leadership in 2024Reported |
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