NVIDIA B100
芯片
GPU
历史
The air-cooled Blackwell that the market skipped on the way to B200.
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The B100 was announced alongside the B200 as a 700 W drop-in for existing H100 air-cooled infrastructure. Demand concentrated on the faster B200 and the rack-scale GB200 instead, and industry reporting through 2024 described B100 volumes as minimal as the roadmap consolidated around B200/B300 — a case study in how fast AI buyers now chase the top bin.
规格与关键参数
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Overview
Designer
NVIDIA
Architecture
Blackwell
Announced
March 2024 (GTC)
Status
Effectively superseded before volume — buyers moved to B200
内存
Memory
192 GB HBM3E, 8 TB/sVendor spec
算力
FP8 (dense)
3.5 PFLOPSVendor spec
FP4 (dense)
7 PFLOPSVendor spec
电力
TDP
700 WVendor spec
它如何与整个技术栈相连
本记录的关联链接一览——点击分组可直接跳转。
设计方
由……制造
内存技术
相关
来源
记录审阅截至 2026-01-15 — 查看 方法论.