Graphcore Bow IPU
芯片
AI加速器
历史
The wafer-on-wafer pioneer whose company became SoftBank's AI chip arm.
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Graphcore's Bow IPU was the first production chip to use wafer-on-wafer 3D stacking (with TSMC), putting a power-delivery die under the compute die. The IPU's 1,472 cores and on-chip SRAM anticipated later designs, but the company missed the LLM wave commercially and was acquired by SoftBank in 2024 — its team now builds AI silicon inside the SoftBank/Arm orbit.
规格与关键参数
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Overview
Designer
Graphcore
Status
Historical — company acquired by SoftBank (2024)
Manufacturing
Process
TSMC N7 with wafer-on-wafer stackingVendor spec
内存
On-chip memory
900 MB SRAMVendor spec
算力
FP16
350 TFLOPSVendor spec
它如何与整个技术栈相连
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设计方
由……制造
归属于
来源
记录审阅截至 2026-01-15 — 查看 方法论.