Cerebras WSE-3
芯片
晶圆级
发货中
A single chip the size of a dinner plate: 4 trillion transistors, 900,000 cores.
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Cerebras builds the largest chip ever made — an entire 300 mm wafer as one device. WSE-3 packs 4 trillion transistors, 900,000 cores and 44 GB of on-chip SRAM with 21 PB/s of internal bandwidth, sidestepping the HBM bottleneck entirely. The trade: models must be sharded across machines for weights, which Cerebras turned into an inference-speed story — serving Llama-class models at thousands of tokens per second. G42 of the UAE is its anchor customer; the company filed to IPO in 2024.
规格与关键参数
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Overview
Designer
Cerebras Systems
Announced
March 2024
Manufacturing
Foundry / process
TSMC N5, single full waferVendor spec
Transistors
4 trillionVendor spec
Die size
46,225 mm²Vendor spec
内存
On-chip memory
44 GB SRAM at 21 PB/sVendor spec
算力
FP16
125 PFLOPS (with Cerebras sparsity)Vendor claim
电力
System power
~23 kW per CS-3 systemVendor spec
Physical
Cores
~900,000Vendor spec
它如何与整个技术栈相连
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设计方
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内部包含
竞品
来源
记录审阅截至 2026-01-15 — 查看 方法论.