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Home › Chips › Cerebras WSE-3

Cerebras WSE-3

Chip Wafer-Scale Shipping

A single chip the size of a dinner plate: 4 trillion transistors, 900,000 cores.

You're looking at a chip record: what this processor is, its key specs, who designs, manufactures and supplies its parts, and where it gets used.

Cerebras builds the largest chip ever made — an entire 300 mm wafer as one device. WSE-3 packs 4 trillion transistors, 900,000 cores and 44 GB of on-chip SRAM with 21 PB/s of internal bandwidth, sidestepping the HBM bottleneck entirely. The trade: models must be sharded across machines for weights, which Cerebras turned into an inference-speed story — serving Llama-class models at thousands of tokens per second. G42 of the UAE is its anchor customer; the company filed to IPO in 2024.

Specifications & key facts

Each figure is labeled by basis: vendor spec, vendor claim, reported, estimate, or official. "Not publicly disclosed" means exactly that — we never invent values.

Overview

Designer Cerebras Systems
Announced March 2024

Manufacturing

Foundry / process TSMC N5, single full waferVendor spec
Transistors 4 trillionVendor spec
Die size 46,225 mm²Vendor spec

Memory

On-chip memory 44 GB SRAM at 21 PB/sVendor spec

Compute

FP16 125 PFLOPS (with Cerebras sparsity)Vendor claim

Power

System power ~23 kW per CS-3 systemVendor spec

Physical

Cores ~900,000Vendor spec

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Sources

Cerebras WSE-3 announcement ↗

Record reviewed as of 2026-01-15 — see Methodology.