AMD Instinct MI325X
Chip
GPU
Shipping
MI300X with 256 GB of HBM3E — the memory-capacity flagship of 2025.
You're looking at a chip record: what this processor is, its key specs, who designs, manufactures and supplies its parts, and where it gets used.
The MI325X keeps CDNA3 compute and moves to 256 GB of HBM3E at 6 TB/s, giving a single GPU enough memory to hold a 405B-parameter model in FP8 across one 8-GPU node. It shipped through 2025 as AMD's answer to the H200.
Specifications & key facts
Each figure is labeled by basis: vendor spec, vendor claim, reported, estimate, or official. "Not publicly disclosed" means exactly that — we never invent values.
Overview
Designer
AMD
Architecture
CDNA 3
Announced
October 2024; systems from Q1 2025
Memory
Memory
256 GB HBM3EVendor spec
Memory bandwidth
6 TB/sVendor spec
Compute
Compute
Same published CDNA3 throughput as MI300X (FP8 dense 2,615 TFLOPS)Vendor spec
Power
TDP
1,000 WVendor spec
How this connects to the rest of the stack
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Sources
Record reviewed as of 2026-01-15 — see Methodology.