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Home › Chips › AMD Instinct MI300A

AMD Instinct MI300A

Chip APU Shipping

CPU and GPU on one package with unified HBM — the chip inside El Capitan.

You're looking at a chip record: what this processor is, its key specs, who designs, manufactures and supplies its parts, and where it gets used.

The MI300A fuses 24 Zen 4 CPU cores and CDNA3 GPU compute onto one 3D-stacked package sharing 128 GB of HBM3 — no PCIe hop, no separate memory pools. It powers El Capitan at Lawrence Livermore, the world's fastest disclosed supercomputer on the November 2024 TOP500 list.

Specifications & key facts

Each figure is labeled by basis: vendor spec, vendor claim, reported, estimate, or official. "Not publicly disclosed" means exactly that — we never invent values.

Overview

Designer AMD
Architecture CDNA 3 + 24 Zen 4 cores
Announced Launched December 2023

Manufacturing

Foundry / process TSMC N5 compute / N6 base dies, 3D-stackedVendor spec
Transistors 146 billionVendor spec

Memory

Memory 128 GB HBM3, unified CPU+GPUVendor spec
Memory bandwidth 5.3 TB/sVendor spec

Power

TDP 550–760 WVendor spec

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Designed by

AMD

Manufactured by

Packaging

Memory technology

Found inside

Sources

AMD Instinct accelerators ↗

Record reviewed as of 2026-01-15 — see Methodology.