{"data":{"slug":"emib","etype":"tech","name":"EMIB & Foveros","cat":"Packaging","subtitle":"Intel's bridge-and-stack packaging arsenal.","summary":"EMIB embeds tiny silicon bridges in the substrate to link adjacent dies; Foveros stacks logic on logic. They power Intel's own products and are the flagship offering of its foundry packaging business — including capacity marketed to external AI customers.","attrs":null,"kf":null,"aliases":["Foveros"],"ticker":null,"exchange":null,"hq":null,"founded":null,"website":null,"status":null,"region":null,"asof":"2026-01-15","sources":[{"url":"https://www.intel.com/content/www/us/en/foundry/packaging.html","label":"Intel advanced packaging"}]},"meta":{"found":true,"count":1,"served_from":"site cache (no live upstream calls)","as_of":"2026-10-14T06:34:35+00:00","disclaimer":"Research and information only — not investment advice. Structured records carry basis labels (vendor spec / reported / estimate); market quotes are delayed/indicative.","attribution":"Records compiled from vendor documentation, official filings and reputable public reporting; market quotes via financial data providers. See /data-sources."}}